Broadcom has successfully tested an end-to-end PCIe Gen 6 setup, marking a major milestone in high-speed interconnect technology.
This testing involved collaboration with Micron SSDs and Teledyne LeCroy’s protocol analysis tools, reinforcing Broadcom’s commitment to next-generation AI and storage acceleration.
PCIe Gen 6:
Doubling the Speed
PCIe (Peripheral Component Interconnect Express) serves as a high-speed link between peripheral devices and a host server’s motherboard.
- PCIe Gen 6 offers 64 Gbps speeds, double that of PCIe Gen 5 and four times that of Gen 4.
- Essential for AI workloads and high-performance computing (HPC).
- CXL v3.0 leverages PCIe Gen 6 for pooled memory and multi-level switching.
- Broadcom focuses on direct SSD-to-AI host connectivity for better speed and efficiency.
Jas Tremblay, Vice President and General Manager of Broadcom’s Data Center Solutions Group, emphasized the significance of this transition, stating:
“The transition from PCIe Gen 5 to Gen 6 has been monumental given the accelerated need for trusted and reliable building blocks in next-gen AI systems.”
Switches and Retimers
- Broadcom is developing a PCIe Gen 6 switch, the PEX 90144.
- Two new retimers are also in development: BCM85668 (8-lane) and BCM85667 (16-lane).
- Retimers restore degraded signals, correct jitter, and extend data transmission distance.
- The PEX 90144 switch's port count is undisclosed, but it may support up to 144 ports based on past models.
- Previous switches include PEX89072 (72 ports, PCIe Gen 5) and PEX88096 (98 ports, PCIe Gen 4).
Industry Collaboration
Broadcom is working closely with Micron and Teledyne LeCroy to ensure seamless integration and interoperability within the PCIe Gen 6 ecosystem.
Joe Mendolia, Vice President of Marketing for Teledyne LeCroy’s Protocol Solutions Group, highlighted their early involvement:
“Our collaboration with Broadcom, leveraging our Summit M616 and M64 Protocol Analyzers and Exercisers, has led to the industry’s first PCIe 6.x interoperability and compliance testing development.”
Micron’s storage division is also backing this initiative, with SVP and GM Jeremy Werner emphasizing the role of PCIe Gen 6 in AI acceleration. He stated,
“Combined with Broadcom’s high-port switch, our SSDs serve as a critical building block for PCIe Gen 6 AI storage. Our successful interoperability testing with Broadcom and Teledyne LeCroy is evidence of the industry’s rapid transition toward a robust end-to-end PCIe Gen 6 portfolio capable of taking AI performance to the next level.”
Broadcom’s progress in PCIe Gen 6 technology represents a pivotal moment for data center innovation.
By enabling faster, more efficient AI and storage architectures, the company is solidifying its position as a leader in next-generation connectivity solutions.
